可控硅模块
菜单产品分类
| Type number | Package version | Package name | Moldule Size | Configuration | VR(V) | IF(A) | IFSM(A) @Tjmax 10ms | VGT(V) @25℃ max | Vt(V) @Tjmax | Generation | Tj | Datasheet |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HKT500-18 | 1800 | 500 | 13000 | 2.5 | 1.65 | -40~+125 |  |
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| HKD380-12 | 1200 | 380 | 14000 | -40~+125 | |
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| HKT350-12 | 1200 | 350 | 9500 | 2.5 | 0.8 | -40~+125 | |
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| HKT300-16 | 115x50x44.5 | 1600 | 300 | 9400 | 2.0 | 0.85 | -40~+125 | |
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| HKH162-16 | T2-B | 94x34x30 | 1800 | 160 | 5200 | 3.0 | 0.9 | -40~+125 | |
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| HKT162-16 | T2-B | 94x34x30 | 1600 | 160 | 4800 | 3.0 | 0.85 | -40~+125 | |
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| HKT106-16 | T1 | 80x21x32 | 1600 | 110 | 1900 | 3.0 | 0.9 | -40~+125 | |
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