SIC mos晶圆
| Type number |
wafer name | Gross Die | Wafer Size | Die Size | Product | VDSS (V) | ID (A) | Configuration | ESD | VGS (V) | Vth (V) Typ | Rdson(mΩ) @VGS15V Typ | Wafer Thickness | Back Metal | Datasheet |
| H3M25120L |
| | 6 inch | 4.6mm*6.2mm | | 1200 | 90 | | | 2.4 | | 25 | 360±50 | Ni/Ag |  |
| H3M45170L |
| | | 5.1mm*5.4mm | | 1700 | | | | 2.5 | | 45 | 360±50 | | |
| H1M17065L |
| | | 4.6mm*6.2mm | | 650 | 118 | | | 2.6 | | 17 | | | |
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